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Physical and Mechanical Properties of Urea Formaldehyde Bonded Particleboard Made from Bamboo Waste

Daisy Biswas
Senior Research Officer
Bangladesh Forest Research Institute. Chittagong. Bangladesh

Samar Kanti Bose
Research Scientist
College of Environmental Science and Forestry. State University of New York, USA.

Mozaffar Hossain
Professor
Institute of Forestry and Environmental Sciences. University of Chittagong, Chittagong. Bangladesh.

Abstract/ Executive Summary:

Development of value added products from any unutilized woody or non-woody material can play a vital role in economic development and also in forest resource conservation of any country. In this study, suitability of planer waste and chips of Bambusa balcooa and Bambusa vulgaris, two locally grown bamboo species of Bangladesh, were investigated for the production of particle board. Urea formaldehyde glue was used as binder. Particle boards (12 mm thickness) were made from each type of material applying 3.5 N/mm² pressure at 140°C press temperature. The panels were tested to determine bending strength, modulus of elasticity, tensile strength, thickness swelling and water absorption.

Keywords: Bambusa balcooa, Bambusa vulgaris, Urea formaldehyde bonded particleboard, Planer waste.

Location: Veneer and Composite Wood Products Division, Bangladesh Forest Research Institute, Chittagong

Start Date: 00-00-0000

End Date: 00-00-0000

Program Area: Postharvest and Agro-processing

Commodity: Bamboo

Objectives:

To assess the suitability of the waste materials planer waste and chips of Bambusa balcooa and Bambusa vulgaris for the development of urea formaldehyde bonded particle board.

Methodology:

The unutilized culm portions (above 5.4 m from the base for B. balcooa and 3.6 m for B. vulgaris) were splitted longitudinally into halves. Each half was then flattened with a local hand tools. The flattened splits were clipped into 38 mm to 50 mm long pieces and converted into chips in hammer mill. The planer wastes were collected locally. The bamboo chips and planer waste were used for making particle board.Liquid urea formaldehyde glue (50% solid content) was used as binder. The proportion of UF was 10% based on oven dry chips. The glue was catalyzed with ammonium chloride as a hardener and then sprayed over the chips and planer waste individually. Three replicate particle boards of size 500 mm × 500 mm and 12 mm thickness with a target density of 750 kg/m³ were made for each category (chips and planer wastes). Initially mats were formed manually with glue sprayed particles and then pressed in a hydraulic hot press at 140°C with specific pressure of 3.5 N/mm²applied for 6 minutes. There after successive pressure of 1.04 N/mm²for 4 minutes and 0.35 N/mm² for 2 minutes were given as breathing time.

The boards were first trimmed and then specimens (3 nos.) were taken from each board to determine bending strength, tensile strength perpendicular to surface, % water absorption and thickness swelling. The test specimens were conditioned in a conditioning room until they attained uniform moisture content of about 10–12% prior testing. The tests were carried out according to ASTM Standard

Source of Information: International Journal of Adhesion and Adhesives. 31:84-87,2011

Article Link (Online Journal):

Funding Source:

1. Government

Budget:

Total Budget (Tk.) :

Achievement/Findings:

This study indicated the suitability of planer waste and chips of B. balcooa and B. vulgaris for making urea formaldehyde bonded particle board. Based on the results the following conclusions were drawn.

? The particle geometry has significant influence on strength properties of the particle boards. Boards made from hammer milled chips are superior to those from planer wastes.

? B. vulgaris produces better and well glued particle boards with properties compared to standards because of its superior gluability compared to B. balcooa.

? Bamboo particle board made from either planer waste or chips is dimensionally less stable. The product could be used for interior applications like furniture component, wall panel etc., but not recommended for places under frequent humidity changes.

Knowledge Management: Journal